Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11655739
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Filing Dt:
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01/19/2007
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Publication #:
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Pub Dt:
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08/16/2007
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Inventors:
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Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian et al
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Title:
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Wafer level packaging to lidded chips
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1126 BUDAPEST |
| UGOCSA U. 4/B |
| BUDAPEST, HUNGARY |
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| DARYL K. NEFF |
| LERNER, DAVID, LITTENBERG, |
| KRUMHOLZ & MENTLIK, LLP |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CLIONA |
| BUILDING ONE, PARKMORE EAST BUSINESS PARK |
| BALLYBRIT, GALWAY, IRELAND |
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| DARYL K. NEFF |
| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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