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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7939614
Issue Dt:
05/10/2011
Application #:
10594221
Filing Dt:
09/25/2006
Publication #:
20070197755
Pub Dt:
08/23/2007
Inventors:
Takashi Sueyoshi, Ken-ichiro Hiwatari, Tadashi Janado, Yoshikazu Shoji et al
Title:
SILICON-CONTAINING CURING COMPOSITION AND HEAT CURED PRODUCT THEREOF
Assignment: 1
Reel/Frame:
018369/0283Recorded: 09/25/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SUEYOSHI, TAKASHI
Exec Dt:
08/29/2006
HIWATARI, KEN-ICHIRO
Exec Dt:
08/29/2006
JANADO, TADASHI
Exec Dt:
08/29/2006
SHOJI, YOSHIKAZU
Exec Dt:
08/29/2006
SUGAWARA, YOSHITAKA
Exec Dt:
08/29/2006
Assignees:
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME
ARAKAWA-KU
TOKYO 116-8554, JAPAN
KANSAI ELECTRIC POWER COMPANY, INC., THE
6-16, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI
OSAKA 530-8270, JAPAN
Correspondent:
YOUNG & THOMPSON
745 SOUTH 23RD STREET
2ND FLOOR
ARLINGTON, VA 22202
Assignment: 2
Reel/Frame:
033708/0962Recorded: 09/10/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
THE KANSAI ELECTRIC POWER COMPANY, INC.
Exec Dt:
08/08/2014
Assignee:
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU
TOKYO, JAPAN 116-8554
Correspondent:
YOUNG & THOMPSON
209 MADISON STREET
SUITE 500
ALEXANDRIA, 22314 UNITED STATES

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