Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11307839
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Filing Dt:
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02/24/2006
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Publication #:
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Pub Dt:
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08/30/2007
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Inventors:
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Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Ping-Feng Lee, Hsin-Lung Kuo, Bin-Wei Lee et al
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Title:
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Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4TH FLOOR, NO. 1, R&D 2ND ROAD |
| HSIN-CHU SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU HSIEN, TAIWAN R.O.C. |
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| MORTON J. ROSENBERG |
| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MARYLAND 21043 |
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