Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11705402
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Filing Dt:
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02/13/2007
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Publication #:
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Pub Dt:
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08/30/2007
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Inventors:
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Tsuyoshi Kobayashi, Shigetsugu Muramatsu
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Title:
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Multilayer wiring substrate and method of connecting the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO, 381-2287, JAPAN |
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| DRINKER BIDDLE & REATH (DC) |
| 1500 K STREET, N.W. |
| SUITE 1100 |
| WASHINGTON, DC 20005-1209 |
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