Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/26/2009
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Application #:
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11454558
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Filing Dt:
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06/16/2006
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Publication #:
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Pub Dt:
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08/30/2007
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Inventor:
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Jiun-Heng Wang
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Title:
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CHIP PACKAGING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, R&D 1ST RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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CANON'S COURT, 22 VICTORIA STREET |
HAMILTON HM12, BERMUDA |
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J.C. PATENTS, INC. |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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