Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11711661
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Filing Dt:
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02/28/2007
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Publication #:
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Pub Dt:
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09/06/2007
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Inventors:
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Yasuo Kimura, Eiichi Asano
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Title:
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Semiconductor encapsulating epoxy resin composition and semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| GERALD M. MURPHY, JR. |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD |
| SUITE 100 EAST, P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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