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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/28/2009
Application #:
11552973
Filing Dt:
10/26/2006
Publication #:
Pub Dt:
09/13/2007
Inventors:
Shigeru Sato, Jiro Takeda, Atsushi Kayama, So Suzuki, Lionel Beneteau
Title:
METHOD AND PROCESS OF MANUFACTURING ROBUST HIGH TEMPERATURE SOLDER JOINTS
Assignment: 1
Reel/Frame:
018906/0066Recorded: 02/13/2007Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/01/2006
Exec Dt:
11/01/2006
Exec Dt:
11/01/2006
Exec Dt:
11/01/2006
Exec Dt:
11/01/2006
Assignee:
200 GILLINGHAM LANE
MD 1
SUGAR LAND, TEXAS 77478
Correspondent:
INTELLECTUAL PROPERTY LAW
SCHLUMBERGER K.K.
2-2-1 FUCHINOBE, SAGAMIHARA-SHI
KANAGAWA-KEN 229-0006 JAPAN

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