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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11587036
Filing Dt:
10/20/2006
Publication #:
Pub Dt:
09/20/2007
Inventors:
Hideaki Morigami, Takashi Ishii
Title:
Heat Sink Material, Manufacturing Method For The Same, And Semiconductor Laser Device
Assignment: 1
Reel/Frame:
018475/0484Recorded: 10/20/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/08/2006
Exec Dt:
08/08/2006
Assignee:
11-11, SHIBA 1-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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