Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11308271
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Filing Dt:
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03/15/2006
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Publication #:
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Pub Dt:
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09/20/2007
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Inventors:
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Wei-Ping Dow, Cheng-Wei Liu
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Title:
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METHOD FOR MONITORING THE FILLING PERFORMANCE OF COPPER PLATING FORMULA FOR MICROVIA FILLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 5-1, CHI LIN N. RD. |
| CHUNG LI CITY, TAOYUAN HSIEN, TAIWAN |
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| PAI PATENT & TRADEMARK LAW FIRM |
| 1001 FOURTH AVENUE, SUITE 3200 |
| SEATTLE, WA 98154 |
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