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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/10/2012
Application #:
11715261
Filing Dt:
03/07/2007
Publication #:
Pub Dt:
09/20/2007
Inventors:
Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou et al
Title:
ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION LAYER
Assignment: 1
Reel/Frame:
019380/0522Recorded: 05/29/2007Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/30/2007
Exec Dt:
05/02/2007
Exec Dt:
05/11/2007
Exec Dt:
05/17/2007
Exec Dt:
05/11/2007
Exec Dt:
04/30/2007
Exec Dt:
05/11/2007
Exec Dt:
05/17/2007
Assignees:
5A SERANGOON NORTH AVENUE 5
SINGAPORE 554574
50 NANYANG AVENUE
SINGAPORE 639798
Correspondent:
STMICROELECTRONICS, INC.
MAIL STATION 2346?
1310 ELECTRONICS DRIVE
CARROLLTON, TX 75006

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