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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11715979
Filing Dt:
03/09/2007
Publication #:
20070227649
Pub Dt:
10/04/2007
Inventors:
Ko Onodera, Katsufumi Sato, Satoshi Kurimoto, Yoji Tozawa, Hiroshi Uemura
Title:
Method and device for forming external electrodes in electronic chip component
Assignment: 1
Reel/Frame:
019051/0081Recorded: 03/09/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ONODERA, KO
Exec Dt:
02/27/2007
SATO, KATSUFUMI
Exec Dt:
02/28/2007
KURIMOTO, SATOSHI
Exec Dt:
03/07/2007
TOZAWA, YOJI
Exec Dt:
02/28/2007
UEMURA, HIROSHI
Exec Dt:
02/27/2007
Assignee:
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU
TOKYO 103-8272, JAPAN
Correspondent:
JAMES A. OLIFF
OLIFF & BERRIDGE, PLC
P.O. BOX 19928
ALEXANDRIA, VA 22320
Assignment: 2
Reel/Frame:
019271/0140Recorded: 05/08/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ONODERA, KO
Exec Dt:
02/27/2007
SATO, KATSUFUMI
Exec Dt:
03/07/2007
KURIMOTO, SATOSHI
Exec Dt:
02/28/2007
TOZAWA, YOJI
Exec Dt:
02/28/2007
UEMURA, HIROSHI
Exec Dt:
02/27/2007
Assignee:
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU
TOKYO 103-8272, JAPAN
Correspondent:
JAMES A. OLIFF
OLIFF & BERRIDGE, PLC
P.O. BOX 19928
ALEXANDRIA, VA 22320

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