Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11396383
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Filing Dt:
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03/30/2006
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Publication #:
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Pub Dt:
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10/04/2007
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Inventors:
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Jin-Shown Shie, C.Y. Hsieh, Chien Chung Lin
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Title:
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Wire-bonding free packaging structure of light emitted diode
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, 6F, CREATION RD., II, SCIENCE BASED INDUSTRIAL PARK |
HSINCHU 300, TAIWAN R.O.C. |
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PERKINS COIE LLP |
P.O. BOX 2168 |
MENLO PARK, CA 94026 |
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