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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11723431
Filing Dt:
03/20/2007
Publication #:
Pub Dt:
10/04/2007
Inventors:
Kazuhiko Sugiura, Hirotsugu Funato, Tetsuo Fujii, Yumi Maruyama
Title:
Cap attachment structure, semiconductor sensor device and method
Assignment: 1
Reel/Frame:
019118/0234Recorded: 03/20/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/05/2007
Exec Dt:
03/09/2007
Exec Dt:
03/09/2007
Exec Dt:
03/08/2007
Assignee:
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF., JAPAN 448-8661
Correspondent:
POSZ LAW GROUP, PLC
12040 SOUTH LAKES DRIVE, SUITE 101
RESTON, VIRGINIA 20191

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