Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/03/2009
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Application #:
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11648443
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Filing Dt:
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12/29/2006
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Publication #:
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Pub Dt:
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10/11/2007
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Inventors:
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Kun-Sheng Chien, Shih-Kuang Chiu, Han-Ping Pu, Cheng-Hsu Hsiao
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Title:
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SEMICONDUCTOR DEVICE PACKAGE WITH A HEAT SINK AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG RD., TANTZU |
TAICHUNG, TAIWAN ROC |
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PETER F. CORLESS |
EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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