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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11697097
Filing Dt:
04/05/2007
Publication #:
Pub Dt:
10/18/2007
Inventors:
Takashi Watanabe, Hiroyuki Saito, Takeshi Senda, Kazuhiko Kashima, Koji Izunome
Title:
SILICON WAFER
Assignment: 1
Reel/Frame:
019437/0857Recorded: 06/15/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/11/2007
Exec Dt:
05/13/2007
Exec Dt:
05/12/2007
Exec Dt:
05/11/2007
Exec Dt:
05/10/2007
Assignee:
6-3 OHSAKI 1-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 141-0032
Correspondent:
OBLON, SPIVAK, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
019649/0859Recorded: 08/06/2007Pages: 13
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/01/2007
Assignee:
6-3, OHSAKI 1-CHOME
SHINAGAWA-KU
TOKYO 141-0032, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL
1940 DUKE STREET
ALEXANDRIA, VIRGINIA 22314

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