Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11790081
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Filing Dt:
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04/23/2007
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Publication #:
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Pub Dt:
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10/25/2007
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Inventors:
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Daisuke Ejima, Tsuyoshi Kida, Hiroshi Yamashita
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Title:
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Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN 211-8668 |
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| SEAN M. MCGINN, ESQ. |
| MCGINN INTELLECTUAL PROP. LAW GROUP PLLC |
| 8321 OLD COURTHOUSE ROAD |
| SUITE 200 |
| VIENNA, VIRGINIA 22182-3817 |
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