Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11824206
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Filing Dt:
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06/29/2007
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Publication #:
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Pub Dt:
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11/01/2007
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Inventors:
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William Edward Burdick JR., James Wilson Rose, Kevin Matthew Durocher et al
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Title:
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Lithography transfer for high density interconnect circuits
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Assignment:
1
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388 GREENWICH STREET |
NEW YORK, NEW YORK 10013 |
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CORPORATION SERVICE COMPANY |
1133 AVENUE OF THE AMERICAS |
SUITE 3100 |
NEW YORK, NY 10036 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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1 PLASTICS AVENUE |
PITTSFIELD, MASSACHUSETTS 01201 |
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TIMOTHY FRANKLIN |
599 LEXINGTON AVENUE |
SHEARMAN & STERLING LLP |
NEW YORK, NY 10022 |
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