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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11597090
Filing Dt:
06/29/2007
Publication #:
Pub Dt:
11/08/2007
Inventor:
Takuo Watanabe
Title:
Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device
Assignment: 1
Reel/Frame:
019497/0019Recorded: 06/29/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/20/2006
Assignee:
2-1-NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU
TOKYO, JAPAN 103-8666
Correspondent:
RAJ S. DAVE
P.O. BOX 770, CHURCH STREET STATION
NEW YORK, NY 10008-0770

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