Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2010
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Application #:
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11583951
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Filing Dt:
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10/20/2006
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Publication #:
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Pub Dt:
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11/15/2007
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Inventors:
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An-Hong Liu, Yeong-Jyh Lin, Yi-Chang Lee, Hsiang-Ming Huang
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Title:
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COB TYPE IC PACKAGE TO ENHANCED BONDIBILITY OF BUMPS EMBEDDED IN SUBSTRATE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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CANON'S COURT, 22 VICTORIA STREET |
HAMILTON HM 12, BERMUDA R.O.C. |
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NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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TROXELL LAW OFFICE PLLC |
5205 LEESBURG PIKE |
SUITE 1404 |
FALLS CHURCH, VA 22041-3401 |
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