Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10557307
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Filing Dt:
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03/12/2007
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Publication #:
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Pub Dt:
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11/22/2007
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Inventors:
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Kanji Shimoohsako, Shigeru Tanaka, Masaru Nishiaka, Takashi Itoh, Mutsuaki Murakami
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Title:
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Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4,NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 530-8288 |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN LLP |
| 1250 CONNECTICUT AVE. NW |
| SUITE 700 |
| WASHINGTON, DC 20036-2657 |
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