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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11797588
Filing Dt:
05/04/2007
Publication #:
Pub Dt:
11/22/2007
Inventors:
Yoshiyuki Kawashima, Yasushi Ishii, Koichi Toba, Satoru Machida, Takashi Hashimoto
Title:
Method of manufacturing a semiconductor device WITH UNIFORM TOP FILM THICKNESS
Assignment: 1
Reel/Frame:
019324/0695Recorded: 05/04/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/06/2007
Exec Dt:
02/06/2007
Exec Dt:
02/06/2007
Exec Dt:
02/07/2007
Exec Dt:
02/06/2007
Assignee:
4-1, MARUNOUCHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN
Correspondent:
MITCHELL W. SHAPIRO
MILES & STOCKBRIDGE P.C.
1751 PINNACLE DRIVE
SUITE 500
MCLEAN, VIRGINIA 22102

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