Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11798684
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Filing Dt:
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05/16/2007
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Publication #:
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Pub Dt:
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11/22/2007
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Inventors:
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Shinichi Chikaki, Ryotaro Yagi, Yoshinori Shishida, Yoko Uchida, Hirofumi Tanaka et al
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Title:
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Method of forming a multilayer wiring by the use of copper damascene technique
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7-1, SHIBA 5-CHOME |
MINATO-KU |
TOKYO, JAPAN |
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21, SAIIN MIZOSAKI-CHO |
UKYO-KU |
KYOTO, JAPAN 615-8585 |
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5-5, KEIHAN-HONDORI 2-CHOME |
MORIGUCHI CITY |
OSAKA, JAPAN 570-8677 |
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2500, HAGISONO |
KANAGAWA |
CHIGASAKI-SHI, JAPAN 253-8543 |
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6-2, OTEMACHI 2-CHOME |
CHIYODA-KU |
TOKYO, JAPAN |
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YOUNG & THOMPSON |
745 S. 23RD STREET |
2ND FLOOR |
ARLINGTON, VA 22202 |
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