Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11444448
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Filing Dt:
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05/31/2006
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Publication #:
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Pub Dt:
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12/06/2007
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Inventor:
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Wai Yew Lo
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Title:
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Method of forming semiconductor packaged device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6501 WILLIAM CANNON DRIVE WEST |
| LAW DEPARTMENT |
| AUSTIN, TEXAS 78729 |
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| FREESCALE SEMICONDUCTOR, INC. |
| MD: TX32/PL02 |
| 7700 WEST PARMER LANE |
| AUSTIN, TX 78729 |
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Assignment:
2
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| 390 GREENWICH STREET |
| NEW YORK, NEW YORK 10013 |
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| CBCINNOVIS DBA FEDERAL RESEARCH |
| 1023 FIFTEENTH STREET, NW, STE 401 |
| ATTN: OLEH HERELIUK |
| WASHINGTON, DC 20005 |
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Assignment:
3
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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| IP RESEARCH PLUS, INC. |
| 21 TADCASTER CIRCLE |
| ATTN: PENELOPE J.A. AGODOA |
| WALDORF, MD 20602 |
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