Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11717840
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Filing Dt:
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03/14/2007
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Publication #:
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Pub Dt:
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12/13/2007
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Inventors:
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Chi-Wei Tien, Jenq-Haur Pan, Chang-Yuan Wu
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Title:
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Cooler module and heat pipe for cooler module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 581, JUIKUANG ROAD, NEIHU |
| TAIPEI, TAIWAN R.O.C. |
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| JOHN G. CHUPA, ESQ. |
| 28535 ORCHARD LAKE ROAD, SUITE 50 |
| FARMINGTON HILLS, MICHIGAN 48334 |
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