Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11423551
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Filing Dt:
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06/12/2006
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Publication #:
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Pub Dt:
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12/13/2007
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Inventors:
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Wei Shi, Daoqiang Lu, Edward A. Zarbock
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Title:
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METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| VIET V. TONG |
| SCHWEGMAN, LUNDBERG & WOESSNER, P.A. |
| P.O. BOX 2938 |
| MINEAPOLIS, MN 55402-0938 |
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