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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	11449907	Filing Dt:	06/08/2006
Publication #:	20070284732	Pub Dt:	12/13/2007
Inventors:	Tzung-Lin Huang, Tsung-Kun Lee, Chun-Hsien Huang
Title:	Semiconductor device, heat dissipating unit, and method for making a heat dissipating unit

Assignment: 1

Reel/Frame:

017969/0396

Recorded: 06/08/2006

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

HUANG, TZUNG-LIN

Exec Dt:

05/22/2006

LEE, TSUNG-KUN

Exec Dt:

05/22/2006

HUANG, CHUN-HSIEN

Exec Dt:

05/22/2006

Assignee:

SUNUP TECHNOLOGY CO., LTD.

7, HYANCYU 4TH RD.,

K.P.E.Z., TAIWAN

Correspondent:

J. GEORG SEKA

TOWNSEND AND TOWSEND AND CREW

2 EMBARCADERO CENTER 8TH FLOOR

SAN FRANCISCO, CA 94111

Assignment: 2

Reel/Frame:

018254/0425

Recorded: 09/14/2006

Pages: 4

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS: SUNUP TECHNOLOGY CO., LTD. 7, HUANCYU 4TH RD., K.E.P.Z., TAIWAN PREVIOUSLY RECORDED ON REEL 017969 FRAME 0396. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.

Assignors:

HUANG, TZUNG-LIN

Exec Dt:

05/22/2006