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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11630165
Filing Dt:
12/20/2006
Publication #:
Pub Dt:
12/13/2007
Inventor:
Brian Hoekstra
Title:
Device, System and Method for Cutting, Cleaving or Separating a Substrate Material
Assignment: 1
Reel/Frame:
022259/0011Recorded: 02/12/2009Pages: 26
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
09/03/2008
Assignees:
C/O INLIGN CAPITAL PARTNERS
2355 EAST CAMELBACK ROAD, SUITE 750
PHOENIX, ARIZONA 85016
160 RIO ROBLES, BUILDING D
SAN JOSE, CALIFORNIA 95134-1809
Correspondent:
JAMIE B. BISCHOFF
BALLARD SPAHR ANDREWS & INGERSOLL, LLP
1735 MARKET STREET, 51ST FLOOR
PHILADELPHIA, PA 19103
Assignment: 2
Reel/Frame:
023556/0651Recorded: 11/24/2009Pages: 4
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/23/2009
Exec Dt:
11/23/2009
Assignee:
7432 E. TIERRA BUENA LANE, SUITE 101
SCOTTSDALE, ARIZONA 85260
Correspondent:
BALLARD SPAHR LLP
1735 MARKET STREET, 51ST FLOOR
PHILADELPHIA, PA 19103

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