Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11630165
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Filing Dt:
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12/20/2006
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Publication #:
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Pub Dt:
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12/13/2007
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Inventor:
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Brian Hoekstra
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Title:
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Device, System and Method for Cutting, Cleaving or Separating a Substrate Material
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Assignment:
1
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C/O INLIGN CAPITAL PARTNERS |
2355 EAST CAMELBACK ROAD, SUITE 750 |
PHOENIX, ARIZONA 85016 |
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160 RIO ROBLES, BUILDING D |
SAN JOSE, CALIFORNIA 95134-1809 |
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JAMIE B. BISCHOFF |
BALLARD SPAHR ANDREWS & INGERSOLL, LLP |
1735 MARKET STREET, 51ST FLOOR |
PHILADELPHIA, PA 19103 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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7432 E. TIERRA BUENA LANE, SUITE 101 |
SCOTTSDALE, ARIZONA 85260 |
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BALLARD SPAHR LLP |
1735 MARKET STREET, 51ST FLOOR |
PHILADELPHIA, PA 19103 |
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