Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11783871
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Filing Dt:
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04/12/2007
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Publication #:
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Pub Dt:
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12/20/2007
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Inventors:
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Myung-Sam Kang, Byoung-Youl Min, Joon-Sung Kim, Je-Gwang Yoo, Jong-Gyu Choi
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Title:
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Printed circuit board for package of electronic components and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO 443-743, KOREA, REPUBLIC OF |
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| STAAS & HALSEY LLP |
| ATTENTION: DAVID M. PITCHER |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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