Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11629876
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Filing Dt:
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12/18/2006
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Publication #:
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Pub Dt:
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12/20/2007
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Inventors:
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Yuji Hasegawa, Tooru Kikuchi, Satoshi Ebana, Yasuhisa Odagawa, Masao Kawasumi et al
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Title:
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Resin Paste For Die Bonding And Its Use
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO 163-0449, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| 1300 NORTH 17TH STREET - SUITE 1800 |
| ARLINGTON, VA 22209 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT -- TO CORRECT 1ST AND 6TH INVENTORS' NAMES PREVIOUSLY RECORDED ON REEL 018723 FRAME 0296 AND TO ALSO CORRECT ERROR IN ADDRESS OF ASSIGNEE ON PREVIOUS COVER SHEET.
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| 1-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO 163-0449, JAPAN |
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| ANTONELLI, TERRY, STOURT & KRAUS, LLP |
| 1300 NORTH 17TH STREET - SUITE 1800 |
| ARLINGTON, VA 22209 |
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