Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11454397
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Filing Dt:
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06/16/2006
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Publication #:
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Pub Dt:
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12/20/2007
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Inventors:
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Xiaomei Bu, Alex See, Fan Zhang, Jane Hui, Tae Jong Lee, Liang Choo Hsia
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Title:
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COMBINED COPPER PLATING METHOD TO IMPROVE GAP FILL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D, STREET 2 |
| LEGAL DEPARTMENT |
| SINGAPORE, SINGAPORE 738406 |
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| WILLIAM J. STOFFEL |
| 1735 MARKET ST. |
| STE A455 |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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RECORD TO CORRECT THREE ASSIGNOR NAMES ON AN ASSIGNMENT RECORDED ON REEL/FRAME 018006/0501
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| 60 WOODLANDS INDUSTRIAL PARK D. |
| STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| WILLIAM J. STOFFEL |
| 1735 MARKET ST.-STE A455 |
| PHILADELPHIA, PA 19103 |
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