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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11714010
Filing Dt:
03/05/2007
Publication #:
Pub Dt:
12/27/2007
Inventors:
Muriel Thomas, Klaus Schaack, Timo Goergen
Title:
Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
Assignment: 1
Reel/Frame:
019760/0380Recorded: 08/28/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/01/2007
Exec Dt:
06/25/2007
Exec Dt:
05/21/2007
Assignee:
RODENBACHER CHAUSSEE 4
HANAU-WOLFGANG, GERMANY 63457
Correspondent:
KALOW & SPRINGUT LLP
WILLIAM D. SCHMIDT, ESQ.
488 MADISON AVENUE
NEW YORK, NY 10022

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