Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11587729
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Filing Dt:
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08/14/2007
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Publication #:
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Pub Dt:
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12/27/2007
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Inventor:
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Takafumi Iida
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Title:
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Adhesive Composition for Sealing Electronic Component, and Process for Manufacturing Organic Electroluminescent Apparatus with Use Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-17, SHINMACHI 1-CHOME |
| NISHI-KU, OSAKA-SHI |
| OSAKA 550-8668, JAPAN |
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| JUN UMEMURO |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-17, SHINMACHI 1-CHOME |
| NISHI-KU, OSAKA-SHI |
| OSAKA 550-8668, JAPAN |
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| JUN UMEMURO |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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