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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11808474
Filing Dt:
06/11/2007
Publication #:
Pub Dt:
01/03/2008
Inventors:
Katsutoshi Kamei, Jun Ishii, Yasunari Ooyabu, Visit Thaveeprungsriporn
Title:
Wired circuit board and producing method thereof
Assignment: 1
Reel/Frame:
019611/0773Recorded: 07/26/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/19/2007
Exec Dt:
05/07/2007
Exec Dt:
04/19/2007
Exec Dt:
04/19/2007
Assignee:
1-2, SHIMO-HOZUMI 1-CHOME
IBARAKI-SHI, OSAKA, JAPAN 567-8680
Correspondent:
JEAN C. EDWARDS
801 PENNSYLVANIA AVE., NW
SUITE 600
WASHINGTON, DC 20004

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