Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11479390
|
Filing Dt:
|
06/30/2006
|
|
Publication #:
|
|
Pub Dt:
|
01/03/2008
| | | | |
|
Inventors:
|
Tsrong Yi Wen, I-Ting Tsai, Enboa Wu
|
|
Title:
|
Semiconductor package system and method of improving heat dissipation of a semiconductor package
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5TH FLOOR 2 SCIENCE PARK EAST AVE. |
| HONG KONG SCIENCE PARK |
| PAK SHEK KOK, SHATIN, NEW TERRITORIES, HONG KONG |
|
|
|
|
| KNOBBE MARTENS OLSON & BEAR LLP |
| 2040 MAIN STREET |
| FOURTEENTH FLOOR |
| IRVINE, CA 92614 |
|
|
Search Results as of:
05/16/2024 09:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
