Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11720066
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Filing Dt:
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07/26/2007
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Publication #:
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Pub Dt:
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01/03/2008
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Inventors:
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Yoshimichi Sogawa, Takao Yamazaki, Nobuaki Takahashi
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Title:
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Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU |
| TOKYO, JAPAN |
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| HAYES SOLOWAY P.C. |
| 3450 E. SUNRISE DRIVE, SUITE 140 |
| TUCSON, AZ 85718 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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