Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/21/2008
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Application #:
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11861295
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Filing Dt:
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09/26/2007
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Publication #:
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Pub Dt:
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01/10/2008
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Inventors:
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Mou-Shiung Lin, Jin-Yuan Lee
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 301/302,NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| JOHN CHEN |
| ROOM 303, 3F., NO. 25, SEC.1, |
| TAIPEI, 10441 TAIWAN |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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