Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11829419
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Filing Dt:
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07/27/2007
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Publication #:
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Pub Dt:
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01/10/2008
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Inventor:
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Chee Chian Lim
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Title:
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INTEGRATED CIRCUIT PACKAGE, PANEL AND METHODS OF MANUFACTURING THE SAME
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-12 |
NEUBIBERG, GERMANY 85579 |
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EDELL, SHAPIRO & FINNAN LLC |
1901 RESEARCH BLVD. |
SUITE 400 |
ROCKVILLE, MD 20850 |
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