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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/19/2010
Application #:
11487741
Filing Dt:
07/17/2006
Publication #:
Pub Dt:
01/17/2008
Inventors:
Hsien-Wei Chen, Jian-Hong Lin, Tzu-Li Lee
Title:
PROCESS FOR IMPROVING THE RELIABILITY OF INTERCONNECT STRUCTURES AND RESULTING STRUCTURE
Assignment: 1
Reel/Frame:
018111/0133Recorded: 07/17/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/13/2006
Exec Dt:
07/13/2006
Exec Dt:
07/14/2006
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN R.O.C. 300-77
Correspondent:
STEVEN H. SLATER
SLATER & MATSIL, LLP
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252-5793

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