Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11789717
|
Filing Dt:
|
04/25/2007
|
|
Publication #:
|
|
Pub Dt:
|
01/24/2008
| | | | |
|
Inventors:
|
Katsumi Okamoto, Kazunori Koide
|
|
Title:
|
Molding method and molding apparatus
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 508-1, YUTKA-MACHI, HIGASHI-KU |
| HAMAMATSU-SHI, SHIZUOKA-KEN, JAPAN |
|
|
|
|
| TOWNSEND AND BANTA |
| C/O PORTFOLIOIP |
| P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
|
|
Search Results as of:
05/07/2024 04:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
