Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/07/2013
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Application #:
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11879464
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Filing Dt:
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07/17/2007
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Publication #:
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Pub Dt:
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01/24/2008
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Inventors:
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Shinichi Hasegawa, Fumiki Higuchi, Toru Ueki
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Title:
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Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-5, MINAMI-HONCHO 1-CHOME |
JOETSU-SHI, NIIGATA, JAPAN 943-8610 |
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BRIAN C. RUPP |
DRINKER BIDDLE & REATH LLP |
191 N. WACKER DRIVE |
SUITE 3700 |
CHICAGO, IL 60606-1698 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE ASSIGNMENT BY THE THIRD ASSIGNOR NEEDS TO BE CHANGED FROM 07/06/2007 TO 07/16/2007 PREVIOUSLY RECORDED ON REEL 019820 FRAME 0563. ASSIGNOR(S) HEREBY CONFIRMS THE DATE LINE OF THIRD INVENTOR..
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5-5, MINAMI-HONCHO 1-CHOME |
JOETSU-SHI, NIIGATA, JAPAN 943-8610 |
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DRINKER BIDDLE & REATH LLP |
191 N. WACKER DRIVE |
SUITE 3700 |
CHICAGO, IL 60606 |
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04/27/2024 02:49 AM
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