Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11616837
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Filing Dt:
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12/27/2006
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Publication #:
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Pub Dt:
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01/31/2008
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Inventors:
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CHIH-CHENG WU, CHANG-KUO YANG
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Title:
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CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F,NO.16 KE-JUNG RD.,SCIENCE-BASED INDUSTRIA PARK |
| CHU-NAN,MIAO-LI HSIEN, TAIWAN |
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| JEFFREY KNAPP |
| 458 E. LAMBERT ROAD |
| FULLERTON, CA 92835 |
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