Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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11708548
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Filing Dt:
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02/21/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Inventors:
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Satoru Yamamoto, Keiichi Kurashina, Takashi Kawakami, Tsutomu Nakada, Hiroyuki Kanda et al
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Title:
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ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
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| WENDEROTH LIND & PONACK, LLP |
| ATTN: W. DOUGLAS HAHM, ESQ. |
| 2033 K STREET, NW |
| SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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