Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2008
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Application #:
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11461663
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Filing Dt:
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08/01/2006
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Publication #:
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Pub Dt:
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02/07/2008
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Inventors:
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Pao-Kang Niu, Pei-Haw Tsao, Hao-Yi Tsai, Yung-Kuan Hsiao, Chung Yu Wang, Shang-Yun Hou et al
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Title:
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BUMP PATTERN DESIGN FOR FLIP CHIP SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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STEVEN E. KOFFS, DUANE MORRIS LLP |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103-4196 |
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