Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/11/2011
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Application #:
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11808028
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Filing Dt:
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06/06/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Inventor:
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Hsien-Shou Wang
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Title:
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FLIP-CHIP PACKAGE SUBSTRATE AND A METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| BACON & THOMAS, PLLC |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 38, HSING PONG RD. |
| KWEI SAN INDUSTRIAL ZONE |
| TAOYUAN, TAIWAN |
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| BACON & THOMASS, PLLC |
| 625 SLATERS LANE |
| SUITE 400 |
| ALEXANDRIA, VA 22314 |
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