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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10589592
Filing Dt:
07/05/2007
Publication #:
20080035473
Pub Dt:
02/14/2008
Inventors:
Nikola Anastasijevic, Jean-Paul Nepper, Martin Koeneke, Dirk Lohrberg, Tom Marttila et al
Title:
Process and Plant for Electrodepositing Copper
Assignment: 1
Reel/Frame:
030851/0419Recorded: 07/22/2013Pages: 10
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
OUTOKUMPU TECHNOLOGY OY
Exec Dt:
04/23/2007
Assignee:
OUTOTEC OYJ
RIIHITONTUNTIE 7
ESPOO, FINLAND 02201
Correspondent:
CHERNOFF VILHAUER MCCLUNG & STENZEL
601 SW SECOND AVENUE
SUITE 1600
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
019916/0028Recorded: 10/03/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ANASTASIJEVIC, NIKOLA, DR.
Exec Dt:
09/14/2007
NEPPER, JEAN-PAUL, DR.
Exec Dt:
09/06/2007
KOENEKE, MARTIN
Exec Dt:
09/03/2007
LOHRBERG, DIRK
Exec Dt:
09/17/2007
MARTTILA, TOM
Exec Dt:
08/17/2007
VIRTANEN, HENRI
Exec Dt:
08/23/2007
Assignee:
OUTOTEC OYJ
RIIHITONTUNTIE 7
ESPOO, FINLAND FI-02200
Correspondent:
MORGAN & FINNEGAN, L.L.P.
3 WORLD FINANCIAL CENTER
ATTN: ANDREW COHEN
NEW YORK, NY 10281-2101

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