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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	10582377	Filing Dt:	03/29/2007
Publication #:	20080035947	Pub Dt:	02/14/2008
Inventors:	Stanton Earl Weaver Jr., Chen-Lun Hsing Chen, Deborah Ann Haitko, Boris Kolodin et al
Title:	Surface Mount Light Emitting Chip Package

Assignment: 1

Reel/Frame:

019172/0811

Recorded: 03/27/2007

Pages: 9

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

WEAVER, STANTON EARL, JR.

Exec Dt:

06/27/2006

CHEN, CHEN-LUN HSING

Exec Dt:

10/04/2006

KOLODIN, BORIS

Exec Dt:

06/23/2006

STECHER, THOMAS ELLIOT

Exec Dt:

06/27/2006

REGINELLI, JAMES

Exec Dt:

06/23/2006

HAITKO, DEBORAH ANN

Exec Dt:

06/27/2006

GAO, XIANG

Exec Dt:

01/03/2007

ELIASHEVICH, IVAN

Exec Dt:

01/02/2007

Assignee:

GELCORE LLC

6180 HALLE DRIVE

VALLEY VIEW, OHIO 44125-4635

Correspondent:

FAY SHARPE LLP

1100 SUPERIOR AVENUE, SEVENTH FLOOR

CLEVELAND, OH 44114

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