Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11629888
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Filing Dt:
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04/30/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Inventors:
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Takahiko Sakaue, Keita Furumoto, Katsuhiko Yoshimaru
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Title:
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Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
TOKYO 141-8584, JAPAN |
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ROTHWELL, FIGG, ERNST & MANBECK |
1425 K STREET, N.W., SUITE 800 |
WASHINGTON, D.C. 20005 |
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