Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11464699
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Filing Dt:
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08/15/2006
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Publication #:
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Pub Dt:
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02/21/2008
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Inventors:
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Leo A. Merilo, Emmanuel A. Espiritu, Dario S. Filoteo JR., Rachel L. Abinan
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Title:
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CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| ROBERT D. ATKINS |
| ONE RENAISSANCE SQUARE |
| TWO NORTH CENTRAL AVENUE |
| PHOENIX, AZ 85004 |
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