Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11739498
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Filing Dt:
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04/24/2007
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Publication #:
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Pub Dt:
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02/28/2008
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Inventors:
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Katsuya Hirano, Hiroshi Horie
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Title:
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SILICON WAFER ETCHING METHOD AND APPARATUS, AND IMPURITY ANALYSIS METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2-1 SHIBAURA, MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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| JOSEPH R. ROBINSON |
| P.O. BOX 770, CHURCH STREET STATION |
| NEW YORK, NY 10008-0770 |
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