Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/03/2012
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Application #:
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11511175
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Filing Dt:
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08/28/2006
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Publication #:
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Pub Dt:
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02/28/2008
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Inventors:
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Hun K. Lee, Sai M. Lee, Li C. Tai
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Title:
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SYSTEMS AND METHODS FOR LOW PROFILE DIE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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AVAGO TECHNOLOGIES, LTD. |
P.O. BOX 1920 |
DENVER, CO 80201-1920 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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AVAGO TECHNOLOGIES, LTD. |
P.O. BOX 1920 |
DENVER, CO 80201 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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KATHY MANKE |
4380 ZIEGLER ROAD |
FORT COLLINS, CO 80525 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5F, NO. 5, INNOVATION ROAD I, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU CITY, TAIWAN |
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WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
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